JESDAE_电子/电路_工程科技_专业资料。JEDEC STANDARD High Temperature Storage Life JESDAE (Revision of. JEDEC STANDARD High Temperature Storage Life JESDAC (Revision of JESDAB) NOVEMBER JEDEC SOLID STATE. JESD A J-STD Preconditioning (PC): PC required for SMDs only. JESD A High Temperature Storage Life (HTSL). °C for hrs.
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JEDEC standards and publications are designed to serve the public interest through eliminating jesd2 between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.
If the final readpoint time window is exceeded then the units may be restressed for the same amount of time that the window is exceeded. As a minimum the following items should be taken into consideration: The time window need not be met if verification data for a given technology is provided.
The electrical test measurements shall consist of parametric and functional tests specified in the applicable procurement document. Modified item C to remove reference of stress duration requirement. Modified text to emphasize that stress duration requirements are stated in qualification documents, such as JESD47 or in customer agreements, and not in this test method.
Requirement, clause number Test method number Clause number Fax: Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement.
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JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes.
The devices may be returned to room ambient conditions for interim electrical measurements. Interim measurements are optional unless otherwise specified. Filter by document type: By downloading this file the individual agrees not to charge for or resell the resulting material. Other suggestions for document improvement: During the test elevated temperatures accelerated test conditions are used without electrical stress applied. z103
JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.
By downloading this file the individual agrees not to charge for or resell the resulting material.
Intermediate measurements are optional unless otherwise specified. I recommend changes to the following: High Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms.
Some punctuation changes are not included. A margin test may be used to detect data retention degradation. nesd22
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed.
Moisture soak as part of the preconditioning is optional. No claims to be in conformance with this standard may be made unless all requirements stated in the standard jesc22 met. If jed22 can provide input, please complete this form and return to: All comments will be collected and dispersed to the appropriate committee s.
Solid State Memories JC This test may be destructive, depending on Time, Temperature and Packaging if any. Quality and Reliability of Solid State Products filter. Publications Department Wilson Blvd. For nonvolatile jsed22, the data specified data retention pattern must be written initially, and then subsequently verified without re-writing.
For example Glass Transition Temperature and thermal stability in air of any polymeric materials.
Suite Arlington, VA 1. Current search Search found 2 items. If the change to a concept involves any words added or deleted excluding deletion of accidentally repeated wordsit is included. Table 1 — High temperature storage conditions Condition A: Table 1 — High Temperature storage conditions Condition A: Search by Keyword or Document Number. Learn more and apply today.
Requirement, clause number Test method number The referenced clause number has proven to be: The devices jezd22 be returned to room ambient mesd22 or any other defined temperature for interim electrical measurements. Cosmetic package defects and degradation of lead finish, or solderability are not considered valid failure criteria jesr22 this stress.
This test may be destructive, depending on time, temperature and packaging if any.
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During the test, accelerated stress temperatures are used without electrical conditions applied. Charge loss in Nonvolatile memories. Some punctuation changes are not included. Multiple Chip Packages JC Degradation of metals includes metallurgical interfaces.